Students attend international conferences in fall 2017

This fall 2 students from the EMRG had papers accepted and presented their work at international conferences. In Sepetember Jennifer Byford presented "Common Misunderstandings and Challenges in Learning Gauss's Law in a Junior Level Electromagnetic Engineering Course" at the 46th International Conference on Engineering Pedagogy in Budapest, Hungary (as seen in the photo). This conference was peer-reviewed and the work was developed as a part of her Future Academic Scholars in Teaching (FAST) fellowship.In October Michael Craton presented "A Polyjet 3D Printed Alternative for Package to RFIC Interconnects" at the European Microwave Week in Nuremberg, Germany. 

Abstracts:

1. Common Misunderstandings and Challenges in Learning Gauss's Law in a Junior Level Electromagnetic Engineering Course
   
   Common misunderstandings when learning Gauss's Law in a college junior level electromagnetic engineering course are identified by observing normal course assessments and conducting one on one student interviews. Additionally, the extent to which students in this course struggle to translate prior mathematics is investigated by codifying student performance on normal assessments using a rubric developed by the authors based on Accreditation Board for Engineering and Technology (ABET) Criterion 3 (a) and (e). Five misconceptions are identified, three of which agree with physics educational literature, as well as a need for better scaffolding the translation of calculus II and multidimensional calculus material. Future work and possible intervention strategies are discussed.
   
   
2. A Polyjet 3D Printed Alternative for Package to RFIC Interconnects
   
   Presented is a study of RFIC interconnect methodologies and a possible 3D printed alternative to traditional strategies. Using polyjet 3D printing technology, an easily re-configurable wide bandwidth interconnect is constructed. Copper conductors are deposited on 3D printed structures which make connection to an IC by means of conductive epoxy. Simulated and measured results for this structure are shown.