A multipurpose tool capable of depositing silicon oxide, silicon nitride, amorphous silicon, and other films (under staff permission).

The Suss MJB3 is a highly versatile mask aligner which can handle 1mm pieces up to 3-inch wafers. UV300 optics(265nm - 350nm).

Electron Cyclotron Resonance Reactive Ion Etcher (ECR/RIE). Can be used to etch Silicon Nitride, Silicon Dioxide, Poly Silicon, many III/V materials and some metals.

A versatile thin-film deposition system for R&D and limited production applications. Standard deposition process modules are: magnetron sputtering, e-beam evaporation, and thermal evaporation.

System can process conductive, non-conductive and composite materials to any level of density, including full density, with high homogeneity and especially strong bonds between particles.

The table-top instrument allows measurements of Thermal Diffusivity and Specific Heat Capacity(CP) from -125°C to 1100°C.

Capable of storing and automatically running process recipes consisting of run time and acceleration rate. Up to 150mm wafers and 4" × 4" (102mm × 102mm) substrates @ 10,000 RPM.

Inert gas system. Glovebox with gas purification system with attainable purity <1 ppm H2O, <1 ppm O2.

Details being collected.

4 processing furnaces with temperature ranges from 400C - 1200C.