Electrical and Computer Engineering
Research Cleanroom

ERC Clean Room

A multipurpose tool capable of depositing silicon oxide, silicon nitride, amorphous silicon, and other films (under staff permission).

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The Suss MJB3 is a highly versatile mask aligner which can handle 1mm pieces up to 3-inch wafers. UV300 optics(265nm - 350nm).

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ECE345

Electron Cyclotron Resonance Reactive Ion Etcher (ECR/RIE). Can be used to etch Silicon Nitride, Silicon Dioxide, Poly Silicon, many III/V materials and some metals.

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ECE477

A versatile thin-film deposition system for R&D and limited production applications. Standard deposition process modules are: magnetron sputtering, e-beam evaporation, and thermal evaporation.

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Capable of storing and automatically running process recipes consisting of run time and acceleration rate. Up to 150mm wafers and 4" × 4" (102mm × 102mm) substrates @ 10,000 RPM.

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Details being collected.

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4 processing furnaces with temperature ranges from 400C - 1200C.

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The RIE-1701 plasma system is designed for advanced etching applications.

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The Electrical and Computer Engineering cleanroom is located in room C16 of the Engineering Reseach Center. The cleanroom is available to university researchers for a basic user fee. The cleanroom is staffed with a full time technican and is available 24 hrs a day via keyless entry system. Users fees are billed once a month. Equipment training is provided for all equipment in the facility or arrangements can be made to have samples prepared by cleanroom staff for a small fee. The lab includes facilities for device fabrication and characterization with a range of equipment, such as plasma etch, PECVD, Metallization (sputter, e-gun, thermal evap) wet chemical stations, thermal (oxidation/diffusion) lithography, and surface analysis tools.

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