ECE Testing Facility
X,Y,Z motion system +/- 10 microns accuracy per stage
Two Sprint Atomizers
One Sprint Fine Feature Deposition Head with Heater and Shutter
Interchangeable Sprint Wide Feature Deposition Head with Shutter
System and Process Control Software
Tool Path Generation Software
Stainless Steel Cabinet with Granite Table Top
CE
Capabilities Fine Feature Sizes to 10 um
Wide Feature Sizes to one millimeter
Many Inks and Substrates
Ink Viscosity Range from 1 to 1000 cP
Nano Material Deposition
Deposition onto 3D Substrates
Low Temperature Processing
Applications Advanced development platform specifically geared for printing electronics onto complex 3D surfaces. Ideally suited for process development, rapid prototyping and low volume production. Example applications include: 3D Antenna for Smart Phones and Tablets
Complex Molded Interconnect Devices
Printed Sensors and Circuits for the Internet of Things
Low Volume Manufacturing
Requires a University account |