Education:
| CALIFORNIA INSTITUTE OF TECHNOLOGY, PASADENA, CA |
 Ph.D. in Electrical Engineering | 2008 |
| M.S. in Electrical Engineering | 2004 |
TSINGHUA UNIVERSITY, BEIJING, CHINA |
| M.E. in Electrical Engineering | 2003 |
| B.E. in Material Science and Engineering | 2001 |
Research Interests:
My research interests lie in all aspects of micro / nano sciences and technologies including:
Micro structures and systems
Micro sensors and actuators
Biomimetic devices and systems
Microfluidics and lab-on-chip systems
MEMS materials
Integration and packaging technologies, and other relevant fields
Selected Publications:
W. Li, D.C. Rodger, and Y.C. Tai, Integrated Wireless Neurostimulator, IEEE MEMS 2009 conference, Sorrento, Italy, Jan. 25-29, 2009.
Wen Li, Damien C. Rodger, Parvathy Menon, and Yu-Chong Tai, Accelerated-lifetime soak testing of parylene packaging, ACS 235th National Meeting, New Orlean, USA, Apr. 6-10, 2008.
W. Li, D.C. Rodger, and Y.C. Tai, Implantable RF-Coiled Chip Packaging, IEEE MEMS 2008 conference, Tucson, USA, Jan. 13-17, 2008.
Damien C. Rodger, Andy J. Fong, Wen Li, Hossein Ameri, Ashish K. Ahuja, Christian Gutierrez, Igor Lavrov, Hui Zhong, Parvathy R. Menon, Ellis Meng, Joel W. Burdick, Roland R. Roy, V. Reggie Edgerton, James D. Weiland, Mark S. Humayun, and Yu-Chong Tai, Flexible Parylene-Based Multielectrode Array Technology for High-Density Neural Stimulation and Recording, Sensors & Actuators: B. Chemical.
Wen Li, Damien C. Rodger, Parvathy Menon, and Yu-Chong Tai, Corrosion Behavior of Parylene-Metal-Parylene Thin Films in Saline, 212th Meeting of the Electrochemical Society (ECS 07), Washington. DC, USA, Oct. 7-12, 2007.
D.C. Rodger, W. Li, A.J. Fong, J.D. Weiland, M.S. Humayun and Y.C. Tai, Parylene-enabled Flexible Prosthetic Devices, Proceedings, SMTA conference, 2007.
Wen Li, Damien C. Rodger, Ellis Meng, James D. Weiland, Mark S. Humayun, and Yu-Chong Tai, Flexible Parylene Packaged Intraocular Coil for Retinal Prostheses, Technical Digest, MMB 06, Okinawa, Japan, May 9-12, 2006.
|
