(Visiting Scientist, Air Force Research Laboratory, Materials and Manufacturing Directorate, 1999)
(Gastprofessor, Max-Planck-Institut für Eisenforschung, Düsseldorf, Germany, 2006)
·
Member
of ASM International (ASM), American Society for Engineering Education (ASEE),
and active leader in the Minerals, Metals, and Materials Society (TMS) on
following committees: Accreditation, Computational Materials Science & Engr, Mechanical Behavior, MPMD Council, Programming,
Shaping and Forming.
·
Chair
of MSE Curriculum Committee at MSU; manage undergrad program, updating
curriculum, accreditation activities (ABET visitor once per year).
·
Winner
of 4 best paper and 1 best poster awards that reflect
important knowledge creation in international conferences for research (voted
by peers or organizers).
·
Industrial
and National Laboratory research collaboration to identify solutions to
production problems in titanium and lead free solder alloys, and pure niobium.
·
International
Collaboration with Max-Planck-Institut für Eisenforschung, in
Düsseldorf, Germany in developing finite element/crystal plasticity
computational modeling approaches for identifying damage nucleation mechanisms
and prediction criteria.
h-factor
(ISI): more than 29 papers have been referred to more than 29 times, > 2294
citations
Reviewed Journal
papers: (10 most recent)
114. Impact of Isothermal Aging
and Sn Grain Orientation on the Long-Term Reliability of Wafer-Level Chip-Scale
Package Sn–Ag–Cu Solder Interconnects, Tae-Kyu
Lee, Bite Zhou, Thomas R. Bieler, IEEE
Transactions on Components and Packaging Technologies (CPMT) 2(3), 496-501, (2012), DOI 10.1109/TCPMT.2011.2181169.
113. Orientation informed nanoindentation
of alpha-titanium: Indentation pileup in hexagonal metals deforming by
prismatic slip, Claudio Zambaldi, Yiyi
Yang, Thomas R. Bieler, Dierk Raabe,
Journal of Materials Research 27(1), 356-367,
2012 DOI: 10.1557/jmr.2011.334.
112. The Role of
Elastic and Plastic Anisotropy of Sn on Recrystallization and Damage Evolution
During Thermal Cycling in SAC305 Solder Joints, Thomas R. Bieler, Bite Zhou,
Lauren Blair, Amir Zamiri, Payam Darbandi, Farhang Pourboghrat, Tae-Kyu Lee,
Kuo-Chuan Liu, Journal of Electronic Materials, 41(2), 283-301, 2012.
111. Impact of Microstructure Evolution and Isothermal
Aging on Sn-Ag-Cu Solder Interconnect Board-Level High-G Mechanical Shock
Performance and Crack Propagation, Tae-Kyu Lee, Bite
Zhou, T.R. Bieler and Kuo-Chuan Liu, Journal
of Electronic Materials, 41(2), 273-282, 2012.
110. In-situ
synchrotron characterization of melting, dissolution and resolidification in
lead-free solders, Bite Zhou, Thomas R. Bieler, Guilin Wu, Stefan Zaefferer, Tae-Kyu Lee, Kuo-Chuan Liu, Journal of Electronic Materials, 41(2), 262-272, 2012.
109. Characterization
and Modeling of Heterogeneous Deformation in Commercial Purity Titanium, Y.
Yang, L. Wang, C. Zambaldi, P. Eisenlohr,
R. Barabash, W. Liu, M.R. Stoudt,
M.A. Crimp, T.R. Bieler, JOM 63(9), 66-73, 2011.
108. Impact of Isothermal Aging on Long-Term
Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder
Interconnects: Die Size Effects Tae-Kyu Lee, Weidong Xie, Bite Zhou, Thomas
Bieler, Kuo-Chuan Liu, J. Electronic Materials 40(9)
1967-76, 2011.
107. Correlation between Sn grain orientation and
corrosion in Sn-Ag-Cu solder interconnects, Tae-Kyu
Lee, Bo Liu, Bite Zhou, Thomas Bieler and Kuo-Chuan
Liu, J. Electronic Materials, 40(9) 1895-1902, 2011.
106. Foreword:
Structural Transitions and Local Deformation Processes at and Near Grain
Boundaries, Bieler Thomas R., Barabash Rozaliya, Banovic Stephen W.,
Metallurgical and Materials Transactions A 42A(3),
553-553, 2011.
105. Quantitative
Atomic Force Microscopy characterization and crystal plasticity finite element
modeling of heterogeneous deformation in commercial purity titanium, Y. Yang,
L. Wang, T. R. Bieler, P. Eisenlohr, M. A. Crimp,
Metall. Mater. Trans A, 42A(3), 636-644, 2011.
104. Experimental
characterization and crystal plasticity modeling of heterogeneous deformation
in polycrystalline α-Ti, Leyun Wang, Rozaliya Barabash, Yiyi Yang, Thomas Bieler, Martin Crimp, Philip Eisenlohr, Wenjun Liu, and Gene
Ice, Metall Mater. Trans A., 42A(3), 626-635, 2011.
12 papers have been cited 50 or more times as of
1/20/12:
211 Acta Mater., 1995 Overview on
Superplasticity
127 J.
Elect. Mater., 1999 on lead-free solder
112 Scripta Mater., 1988 on high strain rate superplasticity
89 Acta Mater., 2001 on hot working
in Ti-6Al-4V
82 Mater.
Sci. Eng. A 1990 on high strain rate superplasticity
70 Acta Mater., 1997 on high strain rate
superplasticity
65 J.
Elect. Mater., 2001 on lead-free solder
55 Phil.
Mag. A, 1995 on twinning in TiAl
52 J.
Elect. Mater., 2004 on lead-free solder
51 J.
Elect. Mater., 2000 on lead-free solder
50 Int.
J. Plasticity 2002 Ti-6Al-4V hot working
50 J.
Materials Res. 2002 First OIM study on solder
96. Overview
No. 149: Overview of constitutive
laws, kinematics, homogenization, and multiscale
methods in crystal plasticity finite element modeling: theory, experiments,
applications, F. Roters, P. Eisenlohr,
L. Hantcherli, D. D. Tjahjanto,
T. R. Bieler, D. Raabe, Acta
Materialia, 58(4) 1152-1211,
(2010).
87. The role of heterogeneous deformation on
damage nucleation at grain boundaries in single phase metals, T.R. Bieler, P. Eisenlohr,
F. Roters, D. Kumar, D.E. Mason, M.A. Crimp, D. Raabe, International
Journal of Plasticity 25(9), 1655–1683, (2009).
83. Influence
of Sn Grain Size and Orientation on the Thermomechanical Response and
Reliability of Pb-free Solder Joints, T.R.
Bieler and H. Jiang, L. P. Lehman, T. Kirkpatrick, E. J. Cotts,
and B. Nandagopal, IEEE Transactions on Components and
Packaging Technologies (CPMT) 31(2), 370-381, (2008). (COVER PHOTO)
75. Incremental
recrystallization/grain growth driven by elastic strain energy release in a thermomechanically fatigued lead-free solder
joint, Telang, A.U., Bieler, T.R., Zamiri, A., Pourboghrat, F., Acta
Materialia 55(7), pp. 2265-2277, (2007).
74. Pb-Free Solder: New Materials Considerations for
Microelectronics Processing, Peter Borgesen, Thomas
Bieler, L.P. Lehman, and E.J. Cotts, MRS Bulletin 32,
(2007), pp. 360-5. (COVER PHOTO)
69. Orientation
Imaging Microscopy of Lead-Free Sn-Ag Solder Joints, A.U. Telang,
T.R. Bieler, JOM, 57(6), 44-49, (2005).
67. Grain
Boundary Sliding on near-7, 14, and 22º Special Boundaries During
Thermomechanical Cycling in Surface-Mount Lead-Free Solder Joint Specimens A.U.Telang, T.R.Bieler, and M.A.
Crimp, Materials Science and Engineering, A421 (1-2) 22-34 (2006).
66. Anisotropic
Plasticity and Cavity Growth during Upset Forging of Ti-6Al-4V, T.R. Bieler,
R.L. Goetz, and S.L. Semiatin, Materials Science and
Engineering A405, pp. 201-213,
(2005).
65. Fracture
Initiation/Propagation Parameters for Duplex TiAl Grain Boundaries Based on
Twinning, Slip, Crystal Orientation, and Boundary Misorientation, T.R. Bieler, A. Fallahi,
B.C. Ng, D. Kumar, M.A. Crimp, B.A. Simkin, A. Zamiri, F. Pourboghrat, D.E. Mason, Intermetallics 13(9),
pp. 979-984, (2005),.
63. Effects
of working, heat treatment, and aging, on microstructural evolution and
crystallographic texture of a, a’, a” and b phases in Ti-6Al-4V wire, L. Zeng
and T.R. Bieler, Materials Science and Engineering A, 392(1-2) pp. 403-414,
(2005).
62. An
Experimental and Theoretical Investigation of the Effect of Colony Orientation and
Misorientation on Cavitation during Hot Working of Ti-6Al-4V, T.R. Bieler, P.D.
Nicolaou, and S.L. Semiatin,
Metallurgical and Materials Transactions, 36A(1) pp. 129-140, (2005).
61. Grain
Boundary Character and Grain Growth in Bulk Tin and Bulk Lead-free Solder
Alloys A.U.Telang, T.R.Bieler,
J.P. Lucas, K.N. Subramanian, L.P. Lehman, Y.Xing,
and E.J. Cotts, Journal of Electronic Materials,
33(12), pp. 1412-1423, (2004).
58. A
Factor to Predict Microcrack Nucleation at gamma-gamma Grain Boundaries in TiAl, B.A. Simkin, M.A. Crimp, T.R. Bieler, Scripta
Materialia 49(2), pp. 149-154, (2003).
51. Orientation
Imaging Studies of Sn-Based Electronic Solder Joints, A.U. Telang,
T.R. Bieler, S. Choi, K.N. Subramanian, Journal of Materials Research 17(9), pp.
2294-2306, (2002).
49. The
Origins of Heterogeneous Deformation During Primary Hot Working of Ti-6Al-4V,
T.R. Bieler and S.L. Semiatin, International Journal
of Plasticity 18, pp. 1165-1189 (2002).
46. The
Effect Of Alpha Platelet Thickness on Plastic Flow During Hot Working Of
Ti-6Al-4V with a Transformed Microstructure, S.L. Semiatin,
T.R. Bieler, Acta Materialia
49, 3565-73 (2001),.
43. Stress
Relaxation Behavior of Tin-Silver Eutectic and Composite Solder Joints, S. Jadhav, T.R. Bieler, K.N. Subramanian, and J.P. Lucas,
Journal of Electronic Materials 30(9), pp. 1197-1205 (2001).
42. Transitions
in Morphology Observed in Nitrogen/Methane-Hydrogen Depositions of
Polycrystalline Diamond Films, V. M. Ayres, M. Farhan,
D. Spach, J. Abdul Majeed,
B. F. Wright, B. L. Wright, J. Asmussen, M. Kanatzidis and T. R. Bieler, Journal of Appled
Physics 89, pp. 6062-8 (2001).
39. Creep
Properties of Eutectic Sn-Ag Solder and Sn-Ag Composite Solders Containing
Intermetallic Particles, S. Choi, J. Lee, F. Guo, T.R.
Bieler, K.N. Subramanian, and J.P. Lucas, JOM 53(6), pp. 22-27(June 2001).
35. Thermomechanical
Fatigue Behavior of Sn-Ag Solder Joints, S. Choi, K.N. Subramanian, J.P. Lucas,
and T.R. Bieler, Journal of Electronic Materials 29, pp. 1249-57, (2000).
32. Characterization
of the Growth of Intermetallic Interfacial Layers of Sn-Ag and Sn-Pb Eutectic Solders and their Composite Solders on Cu
Substrate During Isothermal Long-Term Aging, S. Choi, T.R. Bieler, and K.N.
Subramanian, Journal of Electronic Materials, 28, pp. 1209- (1999).
21. Mechanism
of High Strain Rate Superplasticity in Aluminum Alloy Composites, R.S. Mishra,
T.R. Bieler, and A.K. Mukherjee, Acta Materialia 45(2) pp. 561-568 (1997).
15. A
Numerical Force and Stress Analysis on a Thin Twin Layer in TiAl, Z. Jin and
T.R. Bieler, Philosophical Magazine A 72, pp. 1201-19, (1995).
12. An
In Situ observation of mechanical twinning nucleation
and propagation in TiAl, Z. Jin and T.R. Bieler, Philosophical Magazine A, 71,
pp. 925-47, (1995). 10.1080/01418619508236229
11. Overview
No. 119, Superplasticity in Powder Metallurgy Aluminum Alloys and Composites,
R.S. Mishra, T.R. Bieler, A.K. Mukherjee, Acta Metallurgica et Materialia 43,
pp. 877-891, (1995).
4. The
High Strain Rate Superplastic Deformation Mechanisms of Mechanically Alloyed
Aluminum IN90211, T.R. Bieler and A.K. Mukherjee, Materials Science and
Engineering A128, pp. 171-182, (1990).
1. Superplastic-like
Behavior at High Strain Rates in Mechanically Alloyed Aluminum, T.R. Bieler,
T.G. Nieh, J. Wadsworth, and A.K. Mukherjee, Scripta Metallurgica 22, pp.
81-86, (1988).
Books:
1 Crystal plasticity finite element methods in materials science and engineering, F. Roters, P. Eisenlohr, T.R. Bieler, D. Raabe, Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim, Germany, 2010, ~180 pp.
9 Applications Of Texture Analysis, A
Collection of Papers Presented at the 15th International Conference on Texture
in Materials (ICOTOM 15), June 1-6, 2008, Pittsburgh, Pennsylvania, Chief
Editor, A.D. Rollett, Ceramic
Transactions, Volumes 200 and 201, American Ceramic Society, Westerville, Ohio
43082, 2008 (co-eds Brent Adams, Katayun Barmak,
Thomas Bieler, Keith Bowman, Paul Dawson, Roger Doherty, Olaf Engler, Hamid Garmestani, Amit Goyal, Erik Hilinski, Roland Logé, Lee
Semiatin, Robert Suter,
Carlos Tomé, Sven Vogel, Hasso Weiland, Stuart Wright, (I was one of three editors for the 23 papers in the
hexagonal metals symposium).
8 Processing and Mechanical Response of
Engineering Materials Symposium held in honor of Professor Amiya
Mukherjee at the TMS Annual Meeting, San Antonio, Texas, March 12-16, 2006;
guest editors, J. Schneider, R.S. Mishra, T.R. Bieler, Y.T. Zhu, K.B. Morsi, V.L. Acoff, E.M. Taleff, R. Valiev, G. Kostorz, Materials Science and Engineering A463 (1-2), 15
August 2007, pp 1-288.
7 Trends in Materials and Manufacturing Technologies for
Transportation Industries and Powder Metallurgy Research and Development in the Transportation
Industry, 6th Global Innovations Proceedings, eds, T.R. Bieler, J.E. Carsley, H. Fraser, J.E. Smugeresky,
TMS, Warrendale, PA, 2005,. 394 pages.
6 Hot
Deformation in Aluminum Alloys III, (Proceedings from a symposium held in
San Diego March 3-6, 2003), eds. Z. Jin, A. Beaudoin,
T.A. Bieler, B. Radakrishnan, TMS, Warrendale, PA, 2003, 556 pages.
5 Rate Processes in Plastic Deformation II:
Towards a Unified Constitutive Theory of Deformation, TMS Fall Meeting 2000,
9-10 October, 2000, St. Louis, MO, USA, guest eds. S.V. Raj, T.R. Bieler,
F. A. Mohamed and B. Kad, Materials Science and Engineering, A322 (15 January 2002), pp. 1-256.
4 Hot Deformation in Aluminum Alloys II,
eds. T.R. Bieler, Lawrence Lalli and Stuart MacEwen, TMS Warrendale, PA,
1998, 434 pages.
3 Superplasticity and Superplastic Forming
1998, eds. A.K. Ghosh and T.R. Bieler, TMS Warrendale, PA, 1998, 336 pages.
2 Superplasticity
and Superplastic Forming 1995, eds. A.K. Ghosh
and T.R. Bieler, TMS, Warrendale, PA, 1995, 281
pages.
1 Advances
in Hot Deformation Textures and Microstructures, eds. J.J. Jonas, T.R.
Bieler, and K.J. Bowman, TMS, Warrendale, PA, 1994,
591 pages.
4 Encyclopedia
of Materials: Science and Technology, article on Lead-Free Solder, T.R. Bieler,
and T.-K.Lee, eds.
K. H. Jürgen Buschow, Robert W. Cahn,
Merton C. Flemings, Bernard Ilschner (print), Edward
J. Kramer, Subhash Mahajan,
and Patrick Veyssière (updates)
ISBN:
978-0-08-043152-9, Elsevier, 2010, pp. 1-12.
3 Alloys:
Titanium, in Encyclopedia of Condensed Matter Physics, T.R. Bieler, Ryan M.
Trevino, Liang Zeng, eds,
F. Bassani, G. Liedl, P Wyder, Elsevier Ltd, Oxford, England, (2005) pp. 65-76.
2 "Superplasticity
in Hard-to-Machine Materials", T.R. Bieler, R.S. Mishra and A.K.
Mukherjee, Annual Review of Materials
Science, vol 26, (1996) pp. 75-106.
1 "Mechanical
Shaping of Metal Matrix Composites", K.N. Subramanian, T.R. Bieler and
J.P. Lucas, in Key Engineering Materials,
eds. G.M. Newaz, H. Neber-Aeschbacher
and F.H. Wohlbier, Trans Tech. Ltd., Switzerland,
1995, V104-107, part 1: pp. 175-214.
Reviewed
Conference Articles (selected):
50. The Role of Elastic and
Plastic Anisotropy of Sn on Microstructure and Damage Evolution in Lead-Free
Solder Joints, INVITED, Thomas R. Bieler,
Bite Zhou, Lauren Blair, Amir Zamiri, Payam Darbandi,
Farhang Pourboghrat, Tae-Kyu Lee, Kuo-Chuan
Liu, Proceedings of the International Reliability Physics Symposium (IRPS/IEEE,
Piscataway, NJ, 2011), paper 5F.1, pp. IRPS11-573-81.
46. Effects
of Elastic Modulus on Deformation and Recrystallization of High Purity Nb, D. Baars, H. Jiang, T.R.
Bieler, A. Zamiri, F. Pourboghrat, and C. Compton,
Applications Of Texture Analysis, A Collection of Papers Presented at the 15th
International Conference on Texture in Materials (ICOTOM 15), June 1-6, 2008,
Pittsburgh, Pennsylvania, Chief Editor, A.D. Rollett,
Ceramic Transactions, Volume 201, American Ceramic Society, Westerville, Ohio
43082, 2008, pp. 391-98.
45. Prediction of crack
paths based upon detailed microstructure characterization in a near-g TiAl Alloy, B.C. Ng, T.R. Bieler, M.A. Crimp, D.E.
Mason, TMS MS&T 2004 Symposium on Materials Damage Prognosis Edited by J.M
Larsen, J.R. Calcaterra, L. Christodoulou, M.L. Dent,
W.J. Hardman, J.W. Jones, S.M. Russ, TMS (The Minerals, Metals & Materials
Society, 2005), pp. 307-14.
40. Evolution
of Recrystallization Textures from Cold Rolling Textures With Reversed Rolling
in High Purity Niobium, H. Jiang, T.R. Bieler, C. Compton, T.L. Grimm, TMS
Letters: Vol 1(8) 2004, pp. 177-178.
38. “The
Role of Special Boundaries During Solidification and Microstructure Evolution
in Lead Free Solder Joints”, Adwait U. Telang, Thomas R. Bieler, Proceedings of International
Conference on Texture of Materials, (ICOTOM 14), Leuven Belgium, July 10-15,
2005, Materials Science Forum, 495-497
(2005) pp. 1419-1424.
37. “Dislocation
Activity and Slip Analysis Contributing to Grain Boundary Sliding and Damage
During Thermomechanical Fatigue in Dual Shear Lead-Free Solder Joint
Specimens”, A.U.Telang and T.R.Bieler, International
Conference on Texture and Anisotropy of Polycrystals (ITAP 2),
Metz, France, 2004, Solid State
Phenomena 105 (2005) pp. 219-226.
30. “Mechanisms
of Lamellar Refinement During Primary Creep of Near-Gamma Duplex TiAl”,
D.Y. Seo, T.R. Bieler, International Symposium on Gamma Titanium Aluminides,
eds. Y.W. Kim, D.M. Dimiduk, M.H. Loretto,
(TMS, Warrendale, PA, 1999), pp. 701-8.
28. “Mechanisms
of Primary and Secondary Creep in Near-Gamma TiAl Alloys”, T.R. Bieler,
D.Y. Seo, T.R. Everard,
P.A. McQuay, in Creep
Behavior of Advanced Materials for the 21st Century eds. R.S.
Mishra, A.K. Mukherjee and K. Linga Murty, (TMS, Warrendale, PA,
1999), pp. 181-196.
26. “The
Effect of Carbon Concentration on Primary creep of an Investment Cast
Ti-47Al-2Mn-2Nb+0.8vol%TiB2 Alloy”, D.Y. Seo,
T. Everard, P.A. McQuay,
T.R. Bieler, Interstitial and
Substitutional Solute Effects in Intermetallics, eds. I. Baker, R.D. Noebe, and E.P. George, (TMS, Warrendale,
PA, 1998) pp. 227-244.
20 “Effect
of Interstitial Concentration and Heat Treatment on Microstructure and Primary
Creep of Investment Cast Ti-47Al-2Mn-2Nb with 0.8v% TiB2”,
D.Y. Seo, T.R. Bieler, and D.E. Larsen, High-Temperature Ordered Intermetallic
Alloys VII, eds. C.C. Koch, C.T. Liu, N.S. Stoloff,
A. Wanner,
Mater. Res. Soc. Symp. Proc. Vol. 460
(Pittsburgh, PA, 1997), pp. 281-6.
14 "Region
I Deformation Mechanisms in High Strain Rate Superplastic IN9021", T.R.
Bieler and A.K. Mukherjee, Superplasticity
and Superplastic Forming 1995, eds. A.K. Ghosh
and T.R. Bieler, pp. 153-160, (TMS Warrendale, PA,
1995).
Other Conference Articles:
44 Characterization
of large grain Nb ingot microstructures using EBSP
mapping and Laue camera methods, D. Kang, D.C. Baars,
T.R. Bieler, C. Compton, Symposium on the Superconducting Science and Technology of Ingot Niobium
(SSTIN10), eds. G. R. Myneni,
G. Ciovati, M. Stuart, American Institute of Physics,
conference proceedings v. 1352, (2011), pp. 90-99.
42 The
interaction between grain orientation evolution and thermal cycling as a
function of position in ball grid arrays using Orientation Imaging Microscopy,
Tae-Kyu Lee, Bite Zhou, Lauren Blair, Kuo-Chuan Liu Jie Xue and Thomas R. Bieler, IEEE Proceedings, 60th Electronic Components and Technology Conference
(ECTC) , 2010, Las Vegas, NV.
34 Influence
of Sn Grain Size and Orientation on the Thermomechanical Response and
Reliability of Pb-free Solder Joints, T. R. Bieler,
H. Jiang, L. P. Lehman, T. Kirkpatrick, and E. J. Cotts, 2006
Proceedings. 56th Electronic Components & Technology
Conference (IEEE Cat. No. 06CH37766C), 2006, p 6.
33 Effect
of Growth Velocity on Development of Preferred Orientations in Directionally
Solidified TiAl-2Mo-2Nb, T.R. Bieler, D.Y. Seo, H. Saari, J. Beddoes, Aerospace Materials and
Manufacturing: Development, Testing, and Life Cycle Issues - Honouring William Wallace, 2nd International
Symposium, 43rd Annual Conference of Metallurgists of CIM
Hamilton, ON, August 2004, eds. P.C. Patnaik, M. Hahazi, M. Elboujdaini, J. Luo, MetSoc/CIM 2004, pp 275-87.
31 “Mechanical Properties, Microstructure, and
Texture of Electron Beam Butt Welds in High Purity Niobium”, H.
Jiang, T.R. Bieler, C. Compton, T. Grimm, Proceedings of the 2003
Particle Accelerator Conference (12-19 May 2003, Portland Oregon), IEEE
Publishing, (2003), pp. 1359-1361.
25 “Texture
measurement and simulation of multi-pass hot rolling of Ti-6Al-4V in the two
phase temperature range” Thomas R. Bieler and S.L. Semiatin,
J.J. Jonas symposium, COM 2000, proceedings, CIM, Montreal, 2000, pp. 253-64.
13 "The
Role of Threshold Stresses and Incipient Melting in High Strain Rate
Superplasticity", T.R. Bieler, R.S. Mishra, and A.K. Mukherjee,
Proceedings of International Conference on Superplasticity in Advanced
Materials, Materials Science Forum Vols. 170-2, pp. 65-70, (1994).
Please send any feedback, suggestions, to Tom Bieler Last modified on 8/8/2012