Feb. 4, 2014
Indium Corp. of Clinton, N.Y., announced the appointment of Glen Thomas (MS Chem Egr ’82) as product manager for PCB Assembly Solder Paste on Jan. 30, 2014.
Thomas is responsible for managing the company’s entire line of solder paste materials for PCB assembly. He will work closely with the sales, technical support, research and development, manufacturing, and quality teams to ensure the product line best meets the needs of the customers.
Thomas has more than 25 years of experience working with printed wiring boards and semiconductor packaging. He has held marketing and applications engineering roles at several companies, including Endicott Interconnect Technology, Kyocera, and IBM. He has also traveled extensively throughout Asia and lived in Japan for two years.
Thomas earned his bachelor’s degree in chemical engineering from the University of Wisconsin and his master’s degree, also in chemical engineering, from Michigan State University.
Indium Corp. is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.
For more information, visit www.indium.com.