The Micro and Nano Engineering Facility is located in room C17 in the Engineering Research Center Building.  This is an 800 square foot facility that contains a number of class 100 downflow work areas, and an overall class environment of approximately 100.  It provides equipment for semiconductor wafer processing and lithography, including:

• Suss MJB3 submicron mask aligner

• Gaertner model 115B elipsometer

• Zeiss differential interference contrast microscope

• Diffusion furnances

• Photoresist spinner

• Wafer probing and test equipment (room C18)

• PlasmaQuest reactive ion etching (RIE) system

• Chemical etching wet station

• Oxford PlasmaLab 80 Plus
  Plasma Enhanced Chemical Vapor Deposition (PECVD) System

• AXXIS Physical Vapor Deposition System (sputtering and e-beam)